DocumentCode :
954732
Title :
The Case for Multichip LSI Packaging of High-Reliability Military Electronics
Author :
Farrand, W.A.
Author_Institution :
Rockwell International,Anaheim, CA
Volume :
12
Issue :
4
fYear :
1976
fDate :
12/1/1976 12:00:00 AM
Firstpage :
288
Lastpage :
292
Abstract :
Only by a judicious combination of compatible materials, technology, and "production state of the art" can ruggedness, reliability, versatility, and utilization be realized. This choice can only be achieved through high-quality system · engineering which covers the architecture, detail engineering, manufacturing, inspection, and maintenance of the product throughout its entire service life. The thesis is that the electrical, electronic, thermal, mechanical, construction, test, and rework characteristics must be given proper weight at all points in the design. This paper presents an argument for uncased packages of multichip large-scale integrated (LSI) devices as the best solution for the high-reliability system applications presented here.
Keywords :
Integrated circuit packaging; Electronic packaging thermal management; Electronics packaging; Inspection; Large scale integration; Maintenance; Manufacturing; Materials reliability; Production; Reliability engineering; Systems engineering and theory;
fLanguage :
English
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
0361-1000
Type :
jour
DOI :
10.1109/TPHP.1976.1135159
Filename :
1135159
Link To Document :
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