• DocumentCode
    954984
  • Title

    The process of arc splitting between metal plates in low voltage arc chutes

  • Author

    Lindmayer, Manfred ; Marzahn, Erik ; Mutzke, Alexandra ; Rüther, Thomas ; Springstubbe, Matthias

  • Author_Institution
    Inst. fur Hochspannungstechnik und Elektrische Energieanlagen, Tech. Univ. Braunschweig
  • Volume
    29
  • Issue
    2
  • fYear
    2006
  • fDate
    6/1/2006 12:00:00 AM
  • Firstpage
    310
  • Lastpage
    317
  • Abstract
    The behavior of arcs in low voltage switching devices is affected by several interactions. For studying simple arrangements of arc runners without metallic splitter plates ("deion plates") a three-dimensional simulation system has already been developed. It takes into account the plasma fluid dynamics, the current flow within the electrodes and the plasma, and the magnetic field generated by both currents. In order to model the arc splitting process simulations with an insulating barrier were done in a first step. For the simulation of the splitting process between metallic deion-plates the simulation model has to be extended. In experiments including high-speed movies it is shown that this process is a continuous transition of current flow from the still undivided arc to the new arc roots formed on the metal plates. A new simulation model representing the roots by a thin layer of current-dependent resistivity is discussed and simulation results are compared with switching experiments
  • Keywords
    arcs (electric); simulation; arc root; arc runners; arc simulation; arc splitting; current-dependent resistivity; deion plate; high-speed camera; low voltage arc chutes; low voltage switching devices; metal plates; plasma fluid dynamics; Anodes; Cathodes; Computational modeling; Electromagnetic coupling; Low voltage; Plasma devices; Plasma properties; Plasma simulation; Plasma temperature; Thermal conductivity; Arc root; arc simulation; arc splitting; deion plate; high-speed camera; low voltage;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2006.875902
  • Filename
    1637764