• DocumentCode
    955023
  • Title

    Wiring Algorithms for the Computer-Aided Layout of Multilayer Hybrid Microcircuits

  • Author

    Price, Ian R. ; Moran, Peter

  • Author_Institution
    Plessey Co.
  • Volume
    13
  • Issue
    2
  • fYear
    1977
  • fDate
    6/1/1977 12:00:00 AM
  • Firstpage
    143
  • Lastpage
    146
  • Abstract
    The interconnection algorithm originally presented by Lee is outlined and some of its features are discussed. The implications of the various technologies to which it may be applied are presented, and it is shown that for multilayer hybrid microcircuits the algorithm can be extended to advantage. Typical results using the extended algorithm are given.
  • Keywords
    Hybrid integrated-circuit fabrication; Layout; Conducting materials; Consumer electronics; Costs; Hybrid integrated circuits; Insulation life; Integrated circuit interconnections; Integrated circuit technology; Nonhomogeneous media; Production; Wiring;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1977.1135190
  • Filename
    1135190
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=955023