• DocumentCode
    955281
  • Title

    The Application of Magnetically Enhanced Sputtering in a Production Cylindrical Sputtering System

  • Author

    Arcidiacono, F.

  • Author_Institution
    Western Electric Company,North Andover,MA
  • Volume
    13
  • Issue
    3
  • fYear
    1977
  • fDate
    9/1/1977 12:00:00 AM
  • Firstpage
    268
  • Lastpage
    273
  • Abstract
    A Penning cylindrical sputtering geometry has been used for the production of tantalum thin films. A simple magnetic field-shaping technique coupled with proper target design has produced films with a uniformity characteristic of a quality deposit. The technique has proven to be a cost effective way of producing a high throughput of product in a system designed for a cylindrical sputtering mode.
  • Keywords
    Manufacturing; Sputtering; Tantalum; Thin films; Bonding; Electronics packaging; Geometry; Integrated circuit packaging; Magnetic fields; Magnetic films; Production systems; Sputtering; Thin film circuits; Throughput;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1977.1135216
  • Filename
    1135216