Title :
Unified SPICE compatible model for large and small-signal envelope simulation of linear circuits excited by modulated signals
Author :
Lineykin, Simon ; Ben-Yaakov, Shmuel
Author_Institution :
Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
fDate :
6/1/2006 12:00:00 AM
Abstract :
The envelope-simulation method, developed earlier for large-signal simulation [time domain (TRAN)] is extended to include small-signal envelope simulation (ac) and dc sweep simulation (steady state for a range of carrier frequencies). The model is derived for amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM) modulation schemes and is demonstrated on a piezoelectric transformer circuit. The model is based on the equivalent circuit approach and can be run on any modern electronic circuit simulator. An excellent agreement was found between the simulation results according to the new unified envelope model, full simulation, and experimental results.
Keywords :
SPICE; amplitude modulation; circuit simulation; frequency modulation; phase modulation; piezoelectric devices; power transformers; resonant invertors; DC sweep simulation; amplitude modulation; electronic circuit simulator; equivalent circuit approach; frequency modulation; large-signal envelope simulation method; linear circuits; phase modulation; piezoelectric transformer circuit; resonant inverters; simulation program with integrated circuit emphasis; small-signal envelope simulation method; unified SPICE compatible model; Amplitude modulation; Analytical models; Chirp modulation; Circuit simulation; Electronic ballasts; Linear circuits; Power electronics; Resonance; SPICE; Steady-state; Envelope simulation; piezoelectric transformers; resonant inverters; simulation program with integrated circuit emphasis (SPICE);
Journal_Title :
Industrial Electronics, IEEE Transactions on
DOI :
10.1109/TIE.2006.874421