DocumentCode
955598
Title
Evaluation of thin film MCM materials for high-speed applications
Author
Salmon, Linton G.
Author_Institution
NSF, Washington, DC, USA
Volume
16
Issue
4
fYear
1993
fDate
6/1/1993 12:00:00 AM
Firstpage
388
Lastpage
391
Abstract
The role of material properties in thin-film multichip module (MCM-D) performance as signal frequencies increase above 100 MHz is examined. Specifically, the impact on system performance of dielectric constant, dielectric loss tangent, interconnect metal resistance, and interconnect metal skin depth is discussed. These properties are compared for common MCM-D materials
Keywords
dielectric losses; electric resistance; multichip modules; permittivity; skin effect; MCM-D; dielectric constant; dielectric loss tangent; high-speed applications; interconnect metal resistance; interconnect metal skin depth; signal frequencies; thin film MCM materials; Dielectric constant; Dielectric losses; Dielectric materials; Dielectric thin films; Frequency; Material properties; Multichip modules; Skin; System performance; Transistors;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.237934
Filename
237934
Link To Document