Title :
Surface mounting of very fine pitch components: a new challenge
Author :
Joly, Jean ; Saint-martin, Xavier
Author_Institution :
BULL SA, Les Clayes-sous-Bois, France
fDate :
6/1/1993 12:00:00 AM
Abstract :
Based on their experience in developing and using 16- and 12.5-mil peripheral pitch custom compact single chip packages (CSCPs), the authors analyze the evolution and today´s limits of package and board technologies and assembly techniques, with an emphasis on manufacturability. The manufacturing approach employed and the quality and reliability results obtained for 16- and 12.5-mil peripheral ceramic leaded packages are presented. A detailed analysis of packaging processes and limitations is performed for high-pin-count ceramic and plastic packages. Competitive packaging methods, namely PGA, LGA, and TAB, are compared, and future trends are analyzed
Keywords :
assembling; circuit reliability; packaging; printed circuit manufacture; surface mount technology; tape automated bonding; 12.5 mil; 16 mil; LGA; PGA; TAB; assembly techniques; board technologies; ceramic leaded packages; compact single chip packages; fine pitch components; manufacturability; quality; reliability; Assembly; Central Processing Unit; Ceramics; Electronics packaging; Lead; Manufacturing; Packaging machines; Silicon; Soldering; Testing;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
