DocumentCode
955810
Title
Electrically Insulative Adhesives for Hybrid Microelectronic Fabrication
Author
Brassell, G.W. ; Fancher, D.R.
Author_Institution
Union Carbide Corporation,Oak Ridge, TN
Volume
1
Issue
2
fYear
1978
fDate
6/1/1978 12:00:00 AM
Firstpage
192
Lastpage
197
Abstract
Four insulative adhesives for attachment of alumina substrates to metallic headers in hermetically sealed packages have been evaluated. Tests were performed to determine long-term reliability of the epoxies and to select the most suitable adhesive for use in a highrate hybrid production facility. The adhesive selected for use was a Bstage film epoxy having superior lap shear strength with all platings tested, long pot life, and ease of application in film form.
Keywords
Epoxy resin insulation; Hybrid integrated-circuit bonding; Aging; Circuit testing; Dielectrics and electrical insulation; Fabrication; Gold; Life testing; Microelectronics; Production; Substrates; Temperature;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1978.1135270
Filename
1135270
Link To Document