DocumentCode
955931
Title
The influence of electric field and mobility profile on GaAs MESFET characteristics
Author
Chen, Chung-Hsu ; Arch, David K.
Author_Institution
Honeywell Inc., Bloomington, MN, USA
Volume
36
Issue
11
fYear
1989
fDate
11/1/1989 12:00:00 AM
Firstpage
2405
Lastpage
2414
Abstract
Analytical approximations for the drain I-V relationship, including the mobility profile and field distribution in the channel from the drain to the source, and GaAs MESFETs are derived. The model includes the extended depletion from the gate to the drain for nonself-aligned devices. The calculation of the electric field along the channel is in very good agreement with existing analytical models and a two-dimensional numerical simulation. Experimentally, the authors fabricated and tested tilted angle lightly doped drain (LDD) GaAs MESFETs. It was found that the LLD MESFET structure suppresses the peak electric field under the gate near the drain region. A lower output conductance and higher drain-to-source breakdown were observed as expected. In addition to the electric field, the mobility profile is another factor that influences the performance of the devices. The accuracy of describing the low-field transconductance is strongly dependent on the mobility profile. Moreover, the mobility profile modifies the electric field along the channel and also influences the shape of the drain I-V curves. It is found that more accurate I-V curves can be obtained once the mobility profile is taken into account.
Keywords
III-V semiconductors; Schottky gate field effect transistors; carrier mobility; electric fields; gallium arsenide; semiconductor device models; GaAs; LLD MESFET structure; channel field distribution; drain I-V relationship; drain-to-source breakdown; electric field; low-field transconductance; mobility profile; model; nonself-aligned devices; output conductance; two-dimensional numerical simulation; Analytical models; Breakdown voltage; Circuits; Electric breakdown; Electrodes; Gallium arsenide; MESFETs; Numerical simulation; Shape; Signal processing; Testing; Transconductance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.43660
Filename
43660
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