Title :
Mass Changes of Adhesives During Curing, Exposure to Water Vapor, Evacuation and Outgassing, Part I: Ablefilms 529, 535, and 550
Author :
Vasofsky, Richard W. ; Czanderna, Alvin W. ; Czanderna, Karel K.
Author_Institution :
Clarkson College of Tech.
fDate :
12/1/1978 12:00:00 AM
Abstract :
Mass losses of Ablefilms 529, 535, and 550 during curing ranged from 1-1.8 percent of the adhesive. The major gases evolved included the curing agent, solvent, water, carbon dioxide, and carbon monoxide. Exposure of Ablefilm 529 to 2.4 kPa (18 tort) water vapor yielded a saturation uptake of 0.27 percent of the sample mass, which could supply up to about ten times more water than needed for a dew point of 22°C in a volume of 40 mm3. Ablefilm 550 sorbed even greater quantifies of water.
Keywords :
Integrated circuit bonding; Carbon dioxide; Curing; Humidity; Materials science and technology; Packaging; Physics; Protection; Sealing materials; Semiconductor device measurement; Water resources;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1978.1135295