Title :
Nondestructive Testing of Thru Connections in Printed Wiring Boards
Author_Institution :
Sandia Labs, Albuquerque,NM
fDate :
12/1/1972 12:00:00 AM
Keywords :
Assembly; Electronic equipment testing; Instruments; Integrated circuit interconnections; Manufacturing industries; Nondestructive testing; Plastics; Probes; Refining; Wiring;
Journal_Title :
Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TMFT.1972.1135319
