Title :
Impact of Microminiaturization on Printed Circuit Boards
Author_Institution :
North American Aviation, Inc.
fDate :
6/1/1965 12:00:00 AM
Keywords :
Miniature etched circuit; Aerospace industry; Electronics industry; Electronics packaging; Etching; Integrated circuit interconnections; Laminates; Microelectronics; Printed circuits; Resins; Solid state circuits;
Journal_Title :
Parts, Materials and Packaging, IEEE Transactions on
DOI :
10.1109/TPMP.1965.1135340
