Title :
Universal Component Packaging System
Author_Institution :
Lockheed Missiles & Space Co.
fDate :
6/1/1965 12:00:00 AM
Abstract :
A packaging system is described which provides for the compatible use of integrated circuits, thin film circuits and conventional components in the synthesis of spaeeborne digital command and data handling equipments. Each of the three categories of components are used in a family of 20 module types which can be used to build decoders, programmers, data multiplexers, analog-to-digital converters, data compressors and other specialized digital equipments. Considerations for interconneetion in hybrid systems, both at the module and subsystem level are discussed.
Keywords :
Components; Data handling equipment; Digital equipment; IC (Integrated circuits); Integrated circuits; Interconnections; Memory; Modules; Packaging; Telemetry; Thin-film circuits; Wirewrap; Analog-digital conversion; Data handling; Decoding; Digital integrated circuits; Integrated circuit packaging; Integrated circuit synthesis; Multiplexing; Packaging machines; Programming profession; Thin film circuits;
Journal_Title :
Parts, Materials and Packaging, IEEE Transactions on
DOI :
10.1109/TPMP.1965.1135369
