• DocumentCode
    957153
  • Title

    Electron-Scattering Mechanisms in Heavily Doped Silicon Carbide MOSFET Inversion Layers

  • Author

    Tilak, Vinayak ; Matocha, Kevin ; Dunne, Greg

  • Author_Institution
    Gen. Electr. Global Res., Niskayuna
  • Volume
    54
  • Issue
    11
  • fYear
    2007
  • Firstpage
    2823
  • Lastpage
    2829
  • Abstract
    Hall-effect measurements of n-channel MOS devices were used to determine the main scattering mechanisms limiting mobility in SiC MOSFETs. MOS-gated Hall characterization, which was performed as a function of gate bias and body bias, indicates that surface-roughness scattering and Coulomb scattering are the main scattering mechanisms limiting electron mobility in SiC MOSFETs at room temperature. A charge-sheet model, including incomplete ionization and Fermi-Dirac statistics, is used to calculate the surface electric fields in order to develop an expression for surface-roughness scattering. In the samples used for this paper, at electron sheet densities less than 1.8times1012 cm-2, Coulomb scattering dominates, while surface roughness is dominant at higher sheet densities.
  • Keywords
    Hall effect; MOSFET; scattering; silicon compounds; wide band gap semiconductors; Coulomb scattering; Fermi-Dirac statistics; MOS-gated Hall characterization; MOSFET inversion layers; SiC - Interface; electron-scattering mechanisms; heavily doped silicon carbide; surface electric fields; surface-roughness scattering; Electron mobility; Ionization; MOS devices; MOSFET circuits; Rough surfaces; Scattering; Silicon carbide; Statistics; Surface roughness; Temperature; Coulomb scattering; Hall effect; MOS devices; silicon carbide; surface-roughness scattering;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2007.906929
  • Filename
    4367616