DocumentCode
957365
Title
Degradation of Electrical Contacts Caused by Oscillatory Micromotion Between the Contact Members
Author
Kongsjorden, Helge ; Kulsetås, John ; Sletbak, Jarle
Author_Institution
University of Trondheim,Norway
Volume
2
Issue
1
fYear
1979
fDate
3/1/1979 12:00:00 AM
Firstpage
32
Lastpage
36
Abstract
The influence of oscillatory movement on the contact resistance is discussed on the basis of experiments with contacts in a crossed rod configuration, the contact members being Al-Al and Cu-Cu. Measurements were carried out for movements of amplitudes within the range 0.4-18 µm and mechanical loads between 20-170 N at frequencies 10-100 cycles/h. The experimental results show that micromotion under certain conditions causes rapid and extensive degradation. For Al contacts with load 20 N, the resistance increases to 50 times the initial value after 200 cycles.
Keywords
Aluminum devices; Contacts; Copper devices; Aluminum; Chemicals; Conductivity; Conductors; Contact resistance; Degradation; Springs; Surface resistance; Temperature; Thermal expansion;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1979.1135432
Filename
1135432
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