• DocumentCode
    957365
  • Title

    Degradation of Electrical Contacts Caused by Oscillatory Micromotion Between the Contact Members

  • Author

    Kongsjorden, Helge ; Kulsetås, John ; Sletbak, Jarle

  • Author_Institution
    University of Trondheim,Norway
  • Volume
    2
  • Issue
    1
  • fYear
    1979
  • fDate
    3/1/1979 12:00:00 AM
  • Firstpage
    32
  • Lastpage
    36
  • Abstract
    The influence of oscillatory movement on the contact resistance is discussed on the basis of experiments with contacts in a crossed rod configuration, the contact members being Al-Al and Cu-Cu. Measurements were carried out for movements of amplitudes within the range 0.4-18 µm and mechanical loads between 20-170 N at frequencies 10-100 cycles/h. The experimental results show that micromotion under certain conditions causes rapid and extensive degradation. For Al contacts with load 20 N, the resistance increases to 50 times the initial value after 200 cycles.
  • Keywords
    Aluminum devices; Contacts; Copper devices; Aluminum; Chemicals; Conductivity; Conductors; Contact resistance; Degradation; Springs; Surface resistance; Temperature; Thermal expansion;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1979.1135432
  • Filename
    1135432