• DocumentCode
    957390
  • Title

    Anomalous punchthrough in ULSI buried-channel MOSFETs

  • Author

    Skotnicki, Tomasz ; Merckel, Gérard ; Pedron, Thierry

  • Author_Institution
    CNET-CNS, Meylan, France
  • Volume
    36
  • Issue
    11
  • fYear
    1989
  • fDate
    11/1/1989 12:00:00 AM
  • Firstpage
    2548
  • Lastpage
    2556
  • Abstract
    It is shown that punchthrough (pt) in very short buried-channel P-MOSFETs cannot be suppressed by diminishing the p-channel thickness tc. This is because of the drain-induced channel enlargement (DICE) effect, which switches on and becomes the dominant pt mechanism for very short channels. The DICE effect is independent of tc, and therefore the DICE-related pt component flows even with tc to 0, so that strategies other than channel thinning are needed for the pt to be suppressed. A new implant step, called the retrograde implant, together with the LDD (lightly doped drain) structure, is shown to be able to suppress the DICE effect and thereby shift the limit of pt-immune BC-P-MOSFETs from 0.6 mu m down to 0.3 mu m. The pt encountered below a channel length of 0.3 mu m has been found to result from a pure DIBL effect rather than an incomplete DICE effect suppression. As a result, a further gain in channel shortening (without pt) would require the channel to be even thinner than 0.04 mu m.
  • Keywords
    insulated gate field effect transistors; ion implantation; semiconductor device models; 0.3 to 0.6 micron; LDD structure; ULSI; buried channel MOSFET; channel length; channel shortening; drain induced barrier lowering; drain-induced channel enlargement; implant step; p-channel thickness; punchthrough; retrograde implant; very short channels; Degradation; Helium; Implants; MOSFET circuits; Switches; Ultra large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.43679
  • Filename
    43679