Title :
A Low-Cost Thin-Film Microcircuit Process
Author :
Kerns, David V. ; Kull, Julius M. ; Ruwe, Victor W.
Author_Institution :
Auburn Univ.,AL
fDate :
6/1/1979 12:00:00 AM
Abstract :
A low-cost thin-film microcircuit conductor/resistor technology is developed which offers reduced material costs, a simple fabrication process, relatively low resistor temperature coefficients, and low resistance conductor metalization. The process uses copper for the conductors and Kanthal for the resistors; the process is compatible with certain selective etches to realize a subtractive process.
Keywords :
Integrated circuit economics; Thin-film circuit interconnections; Thin-film resistors; Conducting materials; Conductive films; Copper; Costs; Etching; Fabrication; Inorganic materials; Resistors; Temperature; Transistors;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1979.1135445
