• DocumentCode
    957684
  • Title

    Aging of Solder Connections to Ti-Pd-Au Films

  • Author

    Hall, Peter M. ; Condra, Lloyd W.

  • Author_Institution
    Bell Labs,PA
  • Volume
    2
  • Issue
    3
  • fYear
    1979
  • fDate
    9/1/1979 12:00:00 AM
  • Firstpage
    279
  • Lastpage
    283
  • Abstract
    Soldered connections to TiPdAu film composites show enhanced resistance changes (up to 0.02 ohms) during elevated temperature aging. This is attributed to solid-state dissolution by solder of Au from under the fillet edge, forming a AuSn intermetallic phase. The pull strength of soldered external leads decreases by as much as 40 percent during aging, probably by solid-state dissolution of Pd, forming PdSn4. Neither of these effects is expected to be troublesome at normal operating temperatures.
  • Keywords
    Soldering; Thin-film circuit reliability; Thin-film circuit thermal factors; Aging; Conductive films; Electrical resistance measurement; Gold; Lead; Soldering; Solid state circuits; Temperature; Testing; Thin film circuits;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1979.1135466
  • Filename
    1135466
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=957684