DocumentCode
957997
Title
An MILP Approach to Wafer Sampling and Selection
Author
Good, Richard P. ; Purdy, Matthew A.
Author_Institution
Adv. Process Control Group, Dresden
Volume
20
Issue
4
fYear
2007
Firstpage
400
Lastpage
407
Abstract
This paper introduces a novel algorithm for selecting the optimal wafers for measurement given a set of selection rules. The algorithm is based on assigning a penalty to each of the sampling rules and then using a mixed-integer linear program to pick the wafers which minimize the sum of the penalties. By waiting until the metrology step to determine the best wafers to measure, a real-time decision can be made based on which wafers have previously been measured, the tools and chambers on which wafers were processed, and other user-specified selection criteria. The penalties can also be increased after a rule violation to ensure that each of the selection rules are satisfied at a finite frequency.
Keywords
integer programming; integrated circuit manufacture; integrated circuit measurement; linear programming; substrates; MILP approach; adaptive sampling; metrology step; mixed-integer linear programming; optimal wafer selection; penalty assignment; sampling rules; wafer sampling; Frequency; History; Metrology; Monitoring; Process control; Production facilities; Sampling methods; Semiconductor device manufacture; Adaptive sampling; mixed-integer programming; wafer sampling; wafer-level control;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2007.907616
Filename
4369337
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