• DocumentCode
    957997
  • Title

    An MILP Approach to Wafer Sampling and Selection

  • Author

    Good, Richard P. ; Purdy, Matthew A.

  • Author_Institution
    Adv. Process Control Group, Dresden
  • Volume
    20
  • Issue
    4
  • fYear
    2007
  • Firstpage
    400
  • Lastpage
    407
  • Abstract
    This paper introduces a novel algorithm for selecting the optimal wafers for measurement given a set of selection rules. The algorithm is based on assigning a penalty to each of the sampling rules and then using a mixed-integer linear program to pick the wafers which minimize the sum of the penalties. By waiting until the metrology step to determine the best wafers to measure, a real-time decision can be made based on which wafers have previously been measured, the tools and chambers on which wafers were processed, and other user-specified selection criteria. The penalties can also be increased after a rule violation to ensure that each of the selection rules are satisfied at a finite frequency.
  • Keywords
    integer programming; integrated circuit manufacture; integrated circuit measurement; linear programming; substrates; MILP approach; adaptive sampling; metrology step; mixed-integer linear programming; optimal wafer selection; penalty assignment; sampling rules; wafer sampling; Frequency; History; Metrology; Monitoring; Process control; Production facilities; Sampling methods; Semiconductor device manufacture; Adaptive sampling; mixed-integer programming; wafer sampling; wafer-level control;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2007.907616
  • Filename
    4369337