DocumentCode :
958660
Title :
Foreword - Special Section on Packaging
Author :
Balde, J.
Volume :
3
Issue :
1
fYear :
1980
fDate :
3/1/1980 12:00:00 AM
Firstpage :
3
Lastpage :
3
Keywords :
Integrated circuit packaging; Assembly systems; Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Computer Society; Computer aided manufacturing; Conferences; Electronics packaging; Hardware; Online Communities/Technical Collaboration;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1980.1135569
Filename :
1135569
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=958660
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