IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density

The design objectives and features of two modules are outlined which, with their LSI chips, give significant advantages of performance, power reduction, logic gate density, and reliability in their IBM 4300 processor applications. In these applications an average module gate density of 196 gates/cm²is achieved. This is 30 times the density achieved in IBM´s monolithic systems technology (MST). Even larger density improvements are realized at the card level.