DocumentCode
958835
Title
Effect of Gas Flow Velocity on Tarnish Kinetics of Contact Materials
Author
Ishino, Masakazu ; Kishimoto, Munehisa ; Matsui, Kiyoshi ; Mitani, Shoichi
Author_Institution
Prod. Engineering Res. Lab., Hitachi Ltd., Japan
Volume
3
Issue
1
fYear
1980
fDate
3/1/1980 12:00:00 AM
Firstpage
63
Lastpage
66
Abstract
Experiments were conducted to show the effects of gas flow velocity in the test chamber, the kinds of corrosive gases, and their concentration on the tarnish kinetics of copper and silver. The gas flow velocity was varied from 0.4 cm/s to 42 cm/s. H2 S was selected as the corrosive gas in the single gas test condition, and H2 S, NO2 , and SO2 were selected as the corrosive gases in complex conditions, at room temperature and a relative humidity of 70 percent.
Keywords
Contacts; Contamination; Copper; Silver; Contacts; Copper; Fluid flow; Gases; Glass; Humidity; Kinetic theory; Materials testing; Silver; Temperature;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1980.1135588
Filename
1135588
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