DocumentCode
958857
Title
The BCML Circuit and Packaging System
Author
Stopper, Herbert
Author_Institution
Burroughs Corp,Detroit, MI
Volume
3
Issue
1
fYear
1980
fDate
3/1/1980 12:00:00 AM
Firstpage
110
Lastpage
120
Abstract
A circuit and packaging system for integrated circuits is described. The interrelation between the locical, electrical, mechanical, and thermal interfaces is shown. The leverage which system definition can bring to bear on performance, maintainability, and manufacturability is explored.
Keywords
Integrated circuit packaging; Aging; CMOS logic circuits; Chip scale packaging; Circuit noise; Helium; Integrated circuit packaging; Logic circuits; Semiconductor device noise; Semiconductor device packaging; Voltage;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1980.1135591
Filename
1135591
Link To Document