Circuit-Board Packaging Considerations for Optimum Utilization of Chip Carriers

Effective utilization of large-scale integration (LSI) silicon technology requires efficient packaging of thc non-LSI portions of the circuit. Low density hybrids of four to six chips can be packaged in the same chip carriers as the LSI chips. This not only offers minimal initial costs, but the best chance for subsequent cast reduction as silicon technology permits conversion of the hybrids to chip devices.