Title :
Heat Transfer Correlatins for Use in Naturally Cooled Enclosures with High-Power Integrated Circuits
Author :
Flack, Ronald D. ; Turner, Bruce L.
Author_Institution :
Univ. of Virginia,VA
fDate :
9/1/1980 12:00:00 AM
Abstract :
Heat transfer rates were experimentally measured in an air-filled two-dimensional simplified model of a naturally cooled rectangular enclosure with a concentrated energy source representing a high-power integrated circuit (IC). The aspect ratio of the enclosure and the size and location of the source were parametrically varied. Correlations are presented such that a component temperature rise can be estimated if the energy dissipation rate is known in a specified design.
Keywords :
Integrated circuit thermal factors; Aerospace electronics; Electronics cooling; Electronics packaging; Geometry; Heat transfer; Integrated circuit modeling; Integrated circuit packaging; Packaging machines; Temperature; Thermal conductivity;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1980.1135632
