Title :
Thermal Resistance: A Reliability Consideration
Author :
Manchester, Kenneth E. ; Bird, Donald W.
Author_Institution :
Sprague Electric Company,Worcester, MA
fDate :
12/1/1980 12:00:00 AM
Abstract :
The importance of the mean operating temperature of a monolithic integrated circuit encapsulated in a molded plastic package and its relation to the reliability of that component is reviewed. A thermal model of a plastic package is described and experimentally verified. The model is applied to measure chip or junction temperature under operating conditions, and errors which can be introduced are discussed.
Keywords :
Integrated circuit packaging; Integrated circuit thermal factors; Integrated-circuit reliability testing; Electrical resistance measurement; Integrated circuit measurements; Integrated circuit reliability; Ovens; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device packaging; Temperature dependence; Temperature measurement; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1980.1135666
