Title :
The Use of Computer-Aided Design in the Manufacturing of Welded-Wire Circuit Boards
Author :
Eastwood, Margaret A. ; Baran, Anthony S.
Author_Institution :
McDonell Douglas Automation Co.
fDate :
6/1/1974 12:00:00 AM
Abstract :
Back-plane, welded-wire technology is a packaging concept being used to replace conventional printed-circuit boards. Major reasons for pursuing welded-wire technology are 1) its greater density, which permits elimination of large multilayer printed-circuit boards, and 2) its adaptability to computer-aided design, which reduces drafting and manufacturing costs.
Keywords :
Assembly; Circuit testing; Computer aided manufacturing; Design automation; Nonhomogeneous media; Packaging; Pins; Printed circuits; Welding; Wire;
Journal_Title :
Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TMFT.1974.1135675