DocumentCode :
959675
Title :
The Use of Computer-Aided Design in the Manufacturing of Welded-Wire Circuit Boards
Author :
Eastwood, Margaret A. ; Baran, Anthony S.
Author_Institution :
McDonell Douglas Automation Co.
Volume :
3
Issue :
1
fYear :
1974
fDate :
6/1/1974 12:00:00 AM
Firstpage :
41
Lastpage :
46
Abstract :
Back-plane, welded-wire technology is a packaging concept being used to replace conventional printed-circuit boards. Major reasons for pursuing welded-wire technology are 1) its greater density, which permits elimination of large multilayer printed-circuit boards, and 2) its adaptability to computer-aided design, which reduces drafting and manufacturing costs.
Keywords :
Assembly; Circuit testing; Computer aided manufacturing; Design automation; Nonhomogeneous media; Packaging; Pins; Printed circuits; Welding; Wire;
fLanguage :
English
Journal_Title :
Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0046-838X
Type :
jour
DOI :
10.1109/TMFT.1974.1135675
Filename :
1135675
Link To Document :
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