Title :
Design and Performance of Compact Heatsink for High-Power Diode Edge-Pumped, Microchip Lasers
Author :
Tsunekane, Masaki ; Taira, Takunori
Author_Institution :
Japan Sci. & Technol. Agency, Nagoya
Abstract :
A compact, efficient water-cooled heatsink has been developed for >400 W continuous-wave (CW), diode edge- pumped microchip lasers. A vertical, water jet-impingement cooling system enabled the compact heatsink of 10-mm diameter to be suitable for a close arrangement of the focusing lenses around a microchip. Comparative experimental studies and simulations by finite element analysis show that thermal resistance of the heatsink with a microfin structure on the water-impinged back surface drops to less than 40% that of the heatsink with a conventional flat back surface. The average heat-transfer coefficients over the fin contact area with cooling water were estimated to be 62 and 80 kW/m2. K at water flow rates of 1 and 2 L/min, respectively. The thermal resistance of 0.24degC/W was obtained in an area with a 5-mm diameter of the heatsink with a 140-mum-wide microfin.
Keywords :
cooling; finite element analysis; heat sinks; jets; laser accessories; lenses; microchip lasers; optical focusing; optical pumping; thermal resistance; thermo-optical devices; Yb:YAG lasers; compact heatsink; continuous-wave lasers; diode edge-pumped lasers; finite element analysis; focusing lenses; heat-transfer coefficients; heatsink design; heatsink performance; high-power lasers; microchip lasers; microfin structure; size 140 mum; size 5 mm; thermal resistance; water jet-impingement cooling system; water-cooled heatsink; water-impinged back surface drops; Cooling; Diodes; Heat pumps; Microchip lasers; Optical design; Pump lasers; Resistance heating; Surface resistance; Thermal resistance; Water heating; Cooling; finite element methods; laser thermal factors; solid-state lasers; ytterbium:YAG;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2007.896090
