Title :
TDMR Packaging Special Issue
Author :
Danto, Yves ; Ciappa, Mauro
Abstract :
The one invited and six contributed papers in this special section present new studies in the field of packaging reliability.
Keywords :
Aging; Assembly; Chemistry; Electronic packaging thermal management; Electronics packaging; Humans; Materials reliability; Materials science and technology; Reliability engineering; Thermal degradation;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2008.2005321
