Chip packing efficiency in bubble modules

A magnetic bubble mass memory system containing many chips may be configured in different ways. At one extreme, all the required chips are placed inside one drive coil set and one bias magnet. At the other extreme, each chip is placed in its own drive coil set and bias magnet, and the many single chip magnetic modules are then combined to form a mass memory system. This paper will compare these different approaches in terms of system volume and system power specifications. A generalized model will be described in order to compare these choices in configuration using a uniform set of packaging constraints.