Cooling Components with Boiling Halocarbons

Author

Armstrong, Robert J.

Author_Institution

E.I. Du Pont de Nemours and Company, Inc., Del

Volume

3

Issue

4

fYear

1967

fDate

12/1/1967 12:00:00 AM

Firstpage

135

Lastpage

142

Abstract

One of the most effective ways to dissipate power from a surface is by direct~contact heat transfer to a boiling liquid; that is, by evaporative cooling. High flux density can be obtained at moderate temperature differentials, as much as 100 to 300 kW/m²at about 30 degrees with halocarbons. This liquid cooling method has been used successfully to increase the packaging density of components in electric equipment and to reduce operating temperature. Performance characteristics are described for several cooling systems in which heat-generating components are submerged by liquid dielectrics circulating in free convection. Empirical equations for estimating component-liquid heat flux are recommended, and thermal considerations in the design of packages are discussed.

Keywords

Convection cooling; Coolants; Cooling; Cooling load; Evaporative cooling; Film boiling; Fluorocarbon liquids; Heat flux; Heat transfer; Heat-transfer coefficient; Latent heat transport; Nucleate boiling; Packaging design; Acceleration; Coolants; Dielectric liquids; Electronics cooling; Electronics packaging; Gravity; Heat transfer; Packaging machines; Temperature; Thermal conductivity;

fLanguage

English

Journal_Title

Parts, Materials and Packaging, IEEE Transactions on

Publisher

ieee

ISSN

0018-9502

Type

jour

DOI

10.1109/TPMP.1967.1135738

Filename

1135738