• DocumentCode
    960418
  • Title

    MOS characterization of thermally oxided 6H silicon carbide

  • Author

    Sanders, J.W. ; Pan, Jeng-Shyang ; Xie, Meihua ; Sheppard, S.T. ; Mathur, Manisha ; Melloch, M.R.

  • Author_Institution
    Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN
  • Volume
    40
  • Issue
    11
  • fYear
    1993
  • fDate
    11/1/1993 12:00:00 AM
  • Firstpage
    2130
  • Lastpage
    2131
  • Abstract
    Summary form only given. An MOS evaluation of the SIO2/SiC interface as a function of oxidation conditions and substrate doping is reported. 6H SiC (Si face) epitaxial wafers were thermally oxidized in both wet and dry ambients. MOS capacitors were formed by thermally evaporating circular aluminium field plates. Capacitance transient (C-t) measurements have been performed at elevated temperatures (260-370°C). Approximate values for intrinsic carrier concentration ni as a function of temperature in the range 270-360°C have been obtained directly from the measured C-V curve. These ni values are more than two orders of magnitude larger than would be calculated by extrapolating the accepted room temperature value. Based on these ni values, bulk generation lifetime τ G and surface generation velocity S0 are calculated for an n-type sample using a modified Zerbst technique. Both τG and S0 are within about a factor of 20 of the best reported silicon values
  • Keywords
    carrier lifetime; metal-insulator-semiconductor devices; oxidation; semiconductor materials; semiconductor-insulator boundaries; silicon compounds; 260 to 370 degC; C-V curve; MOS capacitors; MOS evaluation; SIO2/SiC interface; SiO2-SiC; bulk generation lifetime; capacitance transient; dry ambients; modified Zerbst technique; oxidation conditions; substrate doping; surface generation velocity; wet ambients; Capacitance; Capacitance-voltage characteristics; Conductivity; Doping; Fabrication; Passivation; Schottky diodes; Silicon carbide; Temperature; Testing;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.239812
  • Filename
    239812