Title :
Improved RF amplifier mounting scheme
Author :
Driscoll, M.M. ; Stephan, F.H.
Author_Institution :
Westinghouse Electric Corporation, Baltimore, MD
Abstract :
The use of a conductive, silicone rubber-based wafer is described in conjunction with RF amplifier module installation on double-sided printed wiring boards. The new method provides for device heat sinking, device pin stress relief, and low impedance device ultrahigh frequency (UHF) ground connection for achieving cost-effective reliable device performance.
Keywords :
Heat sinks; Impedance; Military equipment; Pins; Radio frequency; Radiofrequency amplifiers; Soldering; Thermal resistance; Thermal stresses; Wiring;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/PROC.1980.11815
