Title :
Fabrication of an insulated metal substrate (IMS), having an insulating layer with a high dielectric constant
Author :
Asai, Shin´ichiro ; Funaki, Mikimasa ; Sawa, Hiroaki ; Kato, Kazuo
Author_Institution :
Denki Kagaku Kougyo K. K., Tokyo, Japan
fDate :
8/1/1993 12:00:00 AM
Abstract :
A copper-based insulated metal substrate (IMS) having an insulating layer with a high dielectric constant has been developed, using an epoxy compound filled with barium titanate filler. A wide variety of polymers and inorganic filters as well as coupling agents were tested for their ability to be fabricated into an insulating layer having a dielectric constant of 26 and a dielectric loss of 0.04 at 400 MHz. The temperature dependence of the cured dielectric was also studied. This copper-based IMS easily allowed for the addition of solder through holes. Reduction in the size of the microstrip line in an UHF power amplifier was attempted. An area less than 1/3 the original size of the conventional glass epoxy printed circuit is expected with this IMS
Keywords :
polymer films; printed circuit manufacture; reliability; substrates; 400 MHz; BaTiO3 filler; Cu; PCB fabrication; RF circuits; UHF power amplifier; coupling agents; cured dielectric; dielectric constant; epoxy compound; inorganic filters; insulated metal substrate; insulating layer; microstrip line; polymers; printed circuit; temperature dependence; Barium; Dielectric losses; Dielectric substrates; Dielectrics and electrical insulation; Fabrication; Filters; High-K gate dielectrics; Polymers; Testing; Titanium compounds;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
