DocumentCode
960778
Title
Chip Carriers-Their Application and Future Direction
Author
Stafford, J.W.
Author_Institution
Bell Labs, NJ
Volume
4
Issue
2
fYear
1981
fDate
6/1/1981 12:00:00 AM
Firstpage
195
Lastpage
199
Abstract
The need for chip carriers and chip-carrier standards is reviewed. Chip-carrier telecommunications applications as well as thermal characteristics of chip carriers are presented. Impediments to chip-carrier applications as well as future directions are reviewed.
Keywords
Integrated circuit packaging; Standards; Application specific integrated circuits; Ceramics; Cost function; Electronics packaging; Integrated circuit packaging; Large scale integration; Manufacturing; Plastics; Standards development; Substrates;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1981.1135793
Filename
1135793
Link To Document