Title :
Chip Carriers-Their Application and Future Direction
Author_Institution :
Bell Labs, NJ
fDate :
6/1/1981 12:00:00 AM
Abstract :
The need for chip carriers and chip-carrier standards is reviewed. Chip-carrier telecommunications applications as well as thermal characteristics of chip carriers are presented. Impediments to chip-carrier applications as well as future directions are reviewed.
Keywords :
Integrated circuit packaging; Standards; Application specific integrated circuits; Ceramics; Cost function; Electronics packaging; Integrated circuit packaging; Large scale integration; Manufacturing; Plastics; Standards development; Substrates;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1981.1135793
