• DocumentCode
    960817
  • Title

    Chip Carrier Applications

  • Author

    Katronge, George A. ; Northover, George

  • Author_Institution
    Digital Equipment Corporation, MA
  • Volume
    4
  • Issue
    2
  • fYear
    1981
  • fDate
    6/1/1981 12:00:00 AM
  • Firstpage
    192
  • Lastpage
    195
  • Abstract
    The chip carrier package is gaining acceptance as a largescale integration (LSI) and very large-scale integration (VLSI) circuit package which can be integrated with medium-scale integration (MSI), small-scale integration (SSI), and passive components onto conventional printed wiring boards. In addition, the chip carrier package is being used to manufacture high density small modules which can be used as stand-alone functions or interfaced with conventional printed circuit boards as modular building blocks. In manufacturing high density small ceramic modules with devices in chip carriers, a soft assembly and test approach has been found to be useful during the start-up phase of a new product.
  • Keywords
    Integrated circuit packaging; Assembly; Chip scale packaging; Circuit testing; Electronics packaging; Integrated circuit interconnections; Large scale integration; Manufacturing; Printed circuits; Sockets; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1981.1135797
  • Filename
    1135797