DocumentCode :
960817
Title :
Chip Carrier Applications
Author :
Katronge, George A. ; Northover, George
Author_Institution :
Digital Equipment Corporation, MA
Volume :
4
Issue :
2
fYear :
1981
fDate :
6/1/1981 12:00:00 AM
Firstpage :
192
Lastpage :
195
Abstract :
The chip carrier package is gaining acceptance as a largescale integration (LSI) and very large-scale integration (VLSI) circuit package which can be integrated with medium-scale integration (MSI), small-scale integration (SSI), and passive components onto conventional printed wiring boards. In addition, the chip carrier package is being used to manufacture high density small modules which can be used as stand-alone functions or interfaced with conventional printed circuit boards as modular building blocks. In manufacturing high density small ceramic modules with devices in chip carriers, a soft assembly and test approach has been found to be useful during the start-up phase of a new product.
Keywords :
Integrated circuit packaging; Assembly; Chip scale packaging; Circuit testing; Electronics packaging; Integrated circuit interconnections; Large scale integration; Manufacturing; Printed circuits; Sockets; Very large scale integration;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1981.1135797
Filename :
1135797
Link To Document :
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