DocumentCode
960817
Title
Chip Carrier Applications
Author
Katronge, George A. ; Northover, George
Author_Institution
Digital Equipment Corporation, MA
Volume
4
Issue
2
fYear
1981
fDate
6/1/1981 12:00:00 AM
Firstpage
192
Lastpage
195
Abstract
The chip carrier package is gaining acceptance as a largescale integration (LSI) and very large-scale integration (VLSI) circuit package which can be integrated with medium-scale integration (MSI), small-scale integration (SSI), and passive components onto conventional printed wiring boards. In addition, the chip carrier package is being used to manufacture high density small modules which can be used as stand-alone functions or interfaced with conventional printed circuit boards as modular building blocks. In manufacturing high density small ceramic modules with devices in chip carriers, a soft assembly and test approach has been found to be useful during the start-up phase of a new product.
Keywords
Integrated circuit packaging; Assembly; Chip scale packaging; Circuit testing; Electronics packaging; Integrated circuit interconnections; Large scale integration; Manufacturing; Printed circuits; Sockets; Very large scale integration;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1981.1135797
Filename
1135797
Link To Document