New mode crack of LSI package in the solder reflow process

Author

Adachi, Mitsuru ; Ohuchi, Shinji ; Totsuka, Norio

Author_Institution

OKI Electr. Ind. Co. Ltd., Tokyo, Japan

Volume

16

Issue

5

fYear

1993

fDate

8/1/1993 12:00:00 AM

Firstpage

550

Lastpage

554

Abstract

A new cracking mode that cannot be explained by the conventional cracking mechanism has been observed under the current circumstance of surface mount components being smaller and thinner and having more stringent requirements in the solder reflow process. This type of crack is generated from the upper portion of the die pad corner, not caused by the delamination between the die pad and the plastic, and is attributed to absorbed moisture reaching the die attachment layer during storage and being vaporized by heat in the soldering. The vapor pressure pushes down the die pad, causing stress in the plastic of upper portion of the die pad corner, and cracks occur. A lead frame design that can prevent this type of crack is described

Keywords

integrated circuit technology; large scale integration; moisture; packaging; soldering; surface mount technology; thermal stress cracking; LSI package; cracking mode; die attachment layer; lead frame design; moisture absorption; solder reflow process; stress; surface mount components; vapor pressure; Delamination; Electronics packaging; Large scale integration; Moisture; Plastic packaging; Sliding mode control; Soldering; Surface cracks; Temperature; Thermal stresses;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.239888

Filename

239888