DocumentCode :
960867
Title :
Foreword
Author :
Domingos, H.
Volume :
4
Issue :
2
fYear :
1981
fDate :
6/1/1981 12:00:00 AM
Firstpage :
165
Lastpage :
165
Keywords :
Integrated circuit packaging; Collaborative work; Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Computer Society; Computer aided manufacturing; Conferences; Documentation; Electronics packaging; Helium; Online Communities/Technical Collaboration;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1981.1135801
Filename :
1135801
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=960867
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