Title :
Design, modeling, and hardware correlation of a 3.2Gb/s/pair memory channel
Author :
Beyene, Wendemagegnehu T. ; Yuan, Xingchao Chuck ; Cheng, Newton ; Shi, Hao
Author_Institution :
Rambus Inc., Los Altos, CA, USA
Abstract :
With the rapid advance of silicon process technology, it is now possible to design input/output (I/O) circuits that operate at multigigabit data rates. As a result, accurate modeling and analysis of high-speed interconnect systems is essential to optimize the performance of the overall system. This paper describes the interconnect design, modeling, simulation, and characterization methodologies that are essential to achieve multigigabit data rates. It focuses on the physical layer verification and hardware correlation of functional systems and silicon to ensure robust system operation over 3.2Gb/s data rate using conventional low-cost packaging and printed circuit board (PCB) technologies. In order to capture conductor and dielectric losses, as well as other high-frequency effects of three-dimensional structures, accurate measurement-based simulation techniques that directly incorporate frequency-domain parameters from measurement or electromagnetic solver parameters into circuit simulation tools using fast Fourier transform (FFT) and bandlimiting windowing techniques are developed. Finally, simulation waveforms are correlated with prototypes at both component and system levels in both time and frequency domains.
Keywords :
bandlimited signals; circuit simulation; fast Fourier transforms; interconnected systems; packaging; printed circuits; 3.2Gb/s/pair memory channel; FFT; PCB; bandlimiting windowing techniques; circuit simulation tools; electromagnetic solver parameters; fast Fourier transform; frequency-domain parameters; functional systems; hardware correlation; interconnect design; low-cost packaging; multigigabit data rates; physical layer verification; printed circuit board; Circuit simulation; Dielectric loss measurement; Dielectric measurements; Electromagnetic measurements; Frequency measurement; Hardware; Integrated circuit interconnections; Loss measurement; Performance analysis; Silicon;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2004.825463