DocumentCode
961045
Title
Review and Reexamination of Reliability Effects Related to NBTI-Induced Statistical Variations
Author
Rauch, Stewart E., III
Author_Institution
IBM Microelectron., Hopewell Junction
Volume
7
Issue
4
fYear
2007
Firstpage
524
Lastpage
530
Abstract
It is now well established that the negative bias temperature instability (NBTI) mechanism alters both the mean and variance of the distribution of the PFET under stress. This effect has reliability implications to balanced analog circuits (e.g., current mirrors, differential pairs, etc.), as well as to SRAM cell stability. This paper presents a brief review of the understanding and models to date of the statistics and impacts of the NBTI-induced variation. This is followed by a critical examination of the actual NBTI-induced distributions and the accuracy of the normal approximations that have been used to date.
Keywords
SRAM chips; integrated circuit modelling; integrated circuit reliability; statistical analysis; thermal stability; NBTI-induced statistical variations; PFET; SRAM cell stability; analog circuits; negative bias temperature instability; normal approximations; reliability effects; Analog circuits; Degradation; Fluctuations; Mirrors; Negative bias temperature instability; Niobium compounds; Statistical distributions; Stochastic processes; Stress; Titanium compounds; Negative bias temperature instability (NBTI); Poisson processes; n/a; reliability modeling; statistics; stochastic approximation; stochastic processes;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2007.910437
Filename
4374081
Link To Document