• DocumentCode
    961051
  • Title

    Transient analysis of lossy transmission lines: an efficient approach based on the method of Characteristics

  • Author

    Grivet-Talocia, Stefano ; Huang, Hao-Ming ; Ruehli, Albert E. ; Canavero, Flavio ; Elfadel, I. M Abe

  • Author_Institution
    Dept. of Electron., Politecnico di Torino, Italy
  • Volume
    27
  • Issue
    1
  • fYear
    2004
  • Firstpage
    45
  • Lastpage
    56
  • Abstract
    This paper is devoted to transient analysis of lossy transmission lines characterized by frequency-dependent parameters. A public dataset of parameters for three line examples (a module, a board, and a cable) is used, and a new example of on-chip interconnect is introduced. This dataset provides a well established and realistic benchmark for accuracy and timing analysis of interconnect analysis tools. Particular attention is devoted to the intrinsic consistency and causality of these parameters. Several implementations based on generalizations of the well-known method-of-characteristics are presented. The key feature of such techniques is the extraction of the line modal delays. Therefore, the method is highly optimized for long interconnects characterized by significant propagation delay. Nonetheless, the method is also successfully applied here to a short high/loss on-chip line, for which other approaches based on lumped matrix rational approximations can also be used with high efficiency. This paper shows that the efficiency of delay extraction techniques is strongly dependent on the particular circuit implementation and several practical issues including generation of rational approximations and time step control are discussed in detail.
  • Keywords
    Hilbert transforms; causality; interconnected systems; transient analysis; transmission lines; Hilbert transform; benchmark; causality; circuit implementation; delay extraction techniques; frequency-dependent parameters; line modal delays; lossy transmission line; lumped matrix rational approximations; method-of-characteristics; on-chip interconnect; propagation delay; timing analysis; transient analysis; Accuracy; Delay lines; Frequency; Integrated circuit interconnections; Optimization methods; Power cables; Propagation losses; Timing; Transient analysis; Transmission lines;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2004.825467
  • Filename
    1288269