• DocumentCode
    961254
  • Title

    A new grid-generation method for 2-D simulation of devices with nonplanar semiconductor surface

  • Author

    Chin, Shan-Ping ; Wu, Ching-Yuan

  • Author_Institution
    Adv. Semicond. Device Res. Lab., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • Volume
    12
  • Issue
    9
  • fYear
    1993
  • fDate
    9/1/1993 12:00:00 AM
  • Firstpage
    1337
  • Lastpage
    1344
  • Abstract
    A general analytical method is proposed for transforming a 2-D multilayer physical domain with the nonplanar semiconductor surface into a 2-D rectangular mathematical domain with a planar surface, with a set of Fourier series being used to describe a general conformal mapping for each layer. Based on the method, a simple iteration algorithm, which incorporates a nonlinear Jacobian-iteration method with the fast Fourier transform (FFT), is developed to solve the system of nonlinear equations due to the mutually coupled boundary conditions. As a result of the analytical conformal mapping, a regular, deformable grid structure can be applied to simulate the device structure with the nonplanar semiconductor surface, and the device simulator using the conventional rectangle-based grid can be easily modified to simulate the device with the nonplanar semiconductor surface
  • Keywords
    digital simulation; electronic engineering computing; fast Fourier transforms; iterative methods; semiconductor device models; series (mathematics); 2D simulation; FFT; Fourier series; conformal mapping; deformable grid structure; device simulator; fast Fourier transform; grid-generation method; iteration algorithm; mutually coupled boundary conditions; nonlinear Jacobian-iteration method; nonlinear equations; nonplanar semiconductor surface; Analytical models; Boundary conditions; Conformal mapping; Deformable models; Fast Fourier transforms; Fourier series; Jacobian matrices; Mutual coupling; Nonhomogeneous media; Nonlinear equations;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.240081
  • Filename
    240081