DocumentCode
961257
Title
Thermal compensation for a chirp fiber Bragg grating bonded substrate
Author
Chang, Y.M. ; Cheng, Chih-Chun ; Lo, Yu-Lung
Author_Institution
Dept. of Mech. Eng., Nat. Chung Cheng Univ., Chia-Yi, Taiwan
Volume
27
Issue
1
fYear
2004
Firstpage
188
Lastpage
193
Abstract
The chirp fiber bragg grating (CFBG) created using the substrate-straining technique requires an invariable center wavelength when subjected to a temperature change. To accomplish this task, a secondary substrate is attached to one side of the main substrate in a bimetallic beam configuration, used as a thermal compensator. However, when the temperature changes, the strain along the CFBG is not uniform because the main substrate is not prismatic. A systematic method based on the shape optimization technique was developed to determine the geometry of the second substrate for temperature compensation. The results show that the second substrate, determined using shape optimization, can produce the required strain distribution to compensate for the center wavelength shift in a CFBG due to temperature changes. Although the thermal compensation of a CFBG demonstrated here is simple, it should be emphasized that this methodology can be easily applied to determine the substrate profile for thermal compensation in other FBG-bonded substrates with nonuniform cross sections.
Keywords
Bragg gratings; bimetals; bonding processes; compensation; substrates; CFBG; FBG-bonded; bimetallic beam configuration; chirp fiber Bragg grating bonded substrate; invariable center wavelength; nonuniform cross sections; shape optimization technique; substrate-straining technique; temperature compensation; thermal compensation; thermal compensator; Bonding; Bragg gratings; Capacitive sensors; Chirp; Fiber gratings; Geometry; Optimization methods; Shape; Temperature; Thermal expansion;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2004.825374
Filename
1288285
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