DocumentCode :
961388
Title :
Foreword
Author :
Bendz, D. ; Palkuti, L.
Author_Institution :
IBM Corp., NY
Volume :
4
Issue :
4
fYear :
1981
fDate :
12/1/1981 12:00:00 AM
Firstpage :
319
Lastpage :
319
Keywords :
Components, packaging, and manufacturing technology; Electronic components; Electronic packaging thermal management; Engineering management; Production; Project management; Reliability engineering; Technical activities; Technology management; Thermal management;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1981.1135852
Filename :
1135852
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=961388
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