DocumentCode :
961397
Title :
Thick Film/Flip Chips-A Systems Approach
Author :
Early, Randolph C.
Author_Institution :
General Electric Comp,Lynchburg, Va
Volume :
4
Issue :
1
fYear :
1975
fDate :
9/1/1975 12:00:00 AM
Firstpage :
2
Lastpage :
8
Abstract :
Thick-film hybrid integrated circuit process currently being used to realized complex circuit functions in hybrid form is discussed. The thick-film technology, active device attachment, and packaging all play important roles in the overall systems approach. A description of the various processes will be presented starting with the ceramic substrate and ending with the completed package. Extensive use is made of computer-controlled laser trimming for both static trimming of resistors and functional trimming of modules after assembly. When properly used, the laser is a powerful tool. Active devices are attached using a solder-reflow technique. All of the connections on the active devices are terminated using solder bumps consisting of a tin/lead alloy. There are corresponding land areas on the ceramic substrate that have been coated with a tin/lead solder. The land areas on the substrate are designed in such a way as to restrict the solder wetting to the small area around the terminal similar to the IBM, "controlled collapse" process [1]. The techniques employed result in thick-film hybrid integrated circuits that are economical, reliable, high in yield, and offer considerable flexibility to the hybrid manufacturer.
Keywords :
Integrated circuit fabrication; Thick-film circuits; Assembly; Ceramics; Hybrid integrated circuits; Integrated circuit packaging; Integrated circuit technology; Lead; Resistors; Substrates; Thick films; Tin;
fLanguage :
English
Journal_Title :
Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0046-838X
Type :
jour
DOI :
10.1109/TMFT.1975.1135853
Filename :
1135853
Link To Document :
بازگشت