DocumentCode

961800

Title

Proceedings of the IEEE: Special Issue on Materials and Material Problems in Integrated Electronics

Author

Ghandhi, S. ; Reich, B.

Author_Institution

Rensselaer Polytechnic Inst.

Volume

4

Issue

3

fYear

1968

fDate

9/1/1968 12:00:00 AM

Firstpage

72

Lastpage

72

fLanguage

English

Journal_Title

Parts, Materials and Packaging, IEEE Transactions on

Publisher

ieee

ISSN

0018-9502

Type

jour

DOI

10.1109/TPMP.1968.1135894

Filename

1135894