Title :
Temperature profile within a metal plate having microelectronic components as heat sources and heat sinks at two extremities
Author :
O´Donnell, Garret ; Honn, J.
Author_Institution :
IBM Corporation,Githersburg, Md.
fDate :
12/1/1968 12:00:00 AM
Keywords :
Bonding; Electronic components; Extremities; Heat sinks; Microelectronics; Packaging; Printed circuits; Resistance heating; Temperature measurement; Thermal spraying;
Journal_Title :
Parts, Materials and Packaging, IEEE Transactions on
DOI :
10.1109/TPMP.1968.1135898
