Title :
Packaging Technology for Josephson Integrated Circuits
Author :
Lahiri, Syamal K. ; Bickford, H. Randall ; Geldermans, Pieter ; Grebe, K.R. ; Moskowitz, Paul A. ; Natan, Menachem ; Palmer, M.J. ; Purushothaman, Sampath ; Sokolowski, John ; Van Der Hoeven, Bernard J C ; Waldman, David P. ; Wang, Run-Han ; Wu, C.T. ; Yo
Author_Institution :
IBM Thomas J. Watson Research Center, Yorktown Heights, NY, USA
fDate :
6/1/1982 12:00:00 AM
Abstract :
Packaging technology used to build the first system crosssection test vehicle in Josephson technology is described. A threedimensional modular card-on-board packaging approach has been selected to fabricate the test vehicle which incorporates all the essential features of the technology required to build a high performance processor prototype. Potential viability of the described packaging technology for the fabrication of such a prototype has been demonstrated by an experiment in which a critical data path has been successfully operated with a minimum cycle time of 3.7 ns.
Keywords :
Integrated circuit packaging; Josephson devices; Assembly; Fabrication; Helium; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Power dissipation; Prototypes; Vehicles; Wiring;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1982.1135958
