Title :
Surface Phenomena in Electronics Interconnection Technology-A Review
Author :
Tissier, Guy ; Gressus, C. ; Bouygues, Jean
Author_Institution :
SOCAPEX, Suresnes Cédex, France
fDate :
6/1/1982 12:00:00 AM
Abstract :
Surface phenomena are often at the origin of interconnection problems and it is necessary to study them with suitable analytical techniques. Auger electron spectroscopy (AES) is used here to establish the cause of observed failures at different levels of electronic interconnection. Failures are related to contamination: the most frequently encountered contaminants are carbonaceous compounds. It is suggested that manufacturing processes are the principal cause of such contaminants.
Keywords :
Bibliographies; Hybrid integrated-circuit interconnections; Integrated circuit interconnections; Interconnections, Integrated circuits; Printed circuits; Surfaces; Atomic measurements; Degradation; Electron emission; Integrated circuit interconnections; Manufacturing industries; Manufacturing processes; Scanning electron microscopy; Spectroscopy; Surface contamination; Surface treatment;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1982.1135965
