• DocumentCode
    962612
  • Title

    Field Studies of Contact Materials: Contact Resistance Behavior of Some Base and Noble Metals

  • Author

    Antler, Morton

  • Author_Institution
    Bell Laboratories, Columbus, OH, USA
  • Volume
    5
  • Issue
    3
  • fYear
    1982
  • fDate
    9/1/1982 12:00:00 AM
  • Firstpage
    301
  • Lastpage
    307
  • Abstract
    The contact resistance of various metals was determined after exposure of from three months to four years in telephone central offices and in nonair-conditioned locations. The logarithm of median contact resistance was stable for some materials, but with most it increased on aging according to linear, parabolic, or logarithmic time relationships. The kinetics of contact resistance change depended on the intrinsic chemical reactivity of the material, the air pollutants which were present in the exposure site, and especially on the relative humidity. Contact resistance-force behaviors were affected also by the topographic and hardness characteristics of the metals. The overall ranking in central offices on the basis of stability of contact resistance from best to worst was 1) gold; 2)high gold-silver alloys, palladium, high palladium-silver alloys, 60Sn40Pb, and tin; 3) copper, high copper alloys, and nickel; and 4) silver. Where relative humidity was only slightly less well-contro11ed, as in a nonair-conditioned room in an urban central office building, except for gold the contact resistances of all materials were from one and two orders of magnitude greater after 40 months of exposure, and often displayed different kinetic behaviors. Palladium was exposed in a total of 18 sites and its contact resistance was found to be highly variable, even exceeding 1000 \\Omega in less than 1 year when relative humidity was high and reactive chlorine-containing air pollutants were present. Pore corrosion of gold electrodeposits and creep of tarnish films from adjacent base metals did not occur in central offices except when the substrate was silver and the level of sulfiding pollutants was high.
  • Keywords
    Communication switching, circuit; Component reliability; Contacts; Environmental testing; Humidity factors; Telephone systems; Air pollution; Central office; Contact resistance; Copper alloys; Gold alloys; Humidity; Inorganic materials; Kinetic theory; Nickel alloys; Tin alloys;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1982.1135976
  • Filename
    1135976